Process of forming contact holes

Details Process of forming contact holes Process of forming contact holes

1994-06-22

1996-03-19

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566561, 1566571, 15665911, 216 46, 437233, 437238, 437245, H01L 2100

Patent

active

055000800

ABSTRACT:
A process for forming self-aligned contact holes in a semiconductor device. In the process, a barrier layer for limiting an opened area of each contact hole is formed by use of a blanket etching process and a chemical vapor deposition process. This method eliminates the use of a mask patterning process upon formation of the selective metal layer to be used as the barrier layer, thereby minimizing the mask misalignment rate and the tolerance caused by the mask misalignment. By virtue of such features, the contact hole formation process enables formation of contact holes each having a minimum opened area enough to form a contact.

REFERENCES:
patent: 5174858 (1992-12-01), Yamamoto et al.

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