Drying processing method and apparatus using same

Drying and gas or vapor contact with solids – Process – Diverse types of drying operations

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

34467, 34 77, 34 78, F26B 700

Patent

active

061348074

ABSTRACT:
A drying processing apparatus for supplying a dry gas to a processing chamber 35, which houses therein semiconductor wafers W, to dry the semiconductor wafers W, including a heater 32 for heating N.sub.2 gas serving as a carrier gas; a vapor generator 34 for making IPA misty by using the N.sub.2 gas heated by the heater 32 and for heating the IPA to produce the dry gas; and a flow control element 36 for supplying a predetermined rate of N.sub.2 gas to the processing chamber 35. Thus, it is possible to improve the efficiency of heat transfer of N.sub.2 gas, and it is possible to increase the amount of produced IPA gas and decrease the time to produce IPA gas. In addition, it is possible to prevent the turbulence of atmosphere in the processing chamber 35 after the drying processing is completed.

REFERENCES:
patent: 4777970 (1988-10-01), Kusuhara
patent: 4878931 (1989-11-01), Grant
patent: 4967486 (1990-11-01), Doelling
patent: 4982512 (1991-01-01), McClenny
patent: 5052126 (1991-10-01), Moe et al.
patent: 5054210 (1991-10-01), Schumacher et al.
patent: 5222307 (1993-06-01), Oba et al.
patent: 5226242 (1993-07-01), Schwenkler
patent: 5249371 (1993-10-01), Saito et al.
patent: 5351419 (1994-10-01), Franka et al.
patent: 5369891 (1994-12-01), Kamikawa
patent: 5371950 (1994-12-01), Schumacher
patent: 5443540 (1995-08-01), Kamikawa
patent: 5535525 (1996-07-01), Gardner
patent: 5539995 (1996-07-01), Bran
patent: 5555634 (1996-09-01), Uchiyama et al.
patent: 5575079 (1996-11-01), Yokomizo et al.
patent: 5657553 (1997-08-01), Tarui et al.
patent: 5671544 (1997-09-01), Yokomizo et al.
patent: 5709037 (1998-01-01), Tanaka et al.
patent: 5749159 (1998-05-01), Schwenkler
patent: 5752532 (1998-05-01), Schwenkler
patent: 5815942 (1998-10-01), Wu et al.
patent: 5884640 (1999-03-01), Fishkin et al.
patent: 5940985 (1999-08-01), Kamikawa et al.
patent: 5950328 (1999-09-01), Ichiko et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Drying processing method and apparatus using same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Drying processing method and apparatus using same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Drying processing method and apparatus using same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1951892

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.