Epoxy-glass integrated circuit package having bonding pads in a

Details Epoxy-glass integrated circuit package having bonding pads in a Epoxy-glass integrated circuit package having bonding pads in a

1986-01-21

1987-02-17

Van Balen, William J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including variation in thickness

428172, 428189, 428190, 428414, 428417, B32B 310, B32B 2738

Patent

active

046439358

ABSTRACT:
An integrated circuit package comprises a plurality of thin flat epoxy-glass layers which are arranged in a stack and are laminated together by prepreg layers that lie between the epoxy-glass layers. This stack has a cavity which is staircase-shaped and extends from an outer epoxy-glass layer to an internal epoxy-glass layer, goes parallel along the internal epoxy-glass layer and then penetrates through it. Patterned electrical conductors lie on the flat surface of the internal epoxy-glass layer, including wire bonding pads on its exposed flat surface portion.

REFERENCES:
patent: 3809601 (1974-05-01), Fletcher
patent: 4407883 (1983-10-01), Newton
patent: 4477512 (1984-10-01), Thomas et al.
patent: 4495239 (1985-01-01), Pusch et al.
patent: 4526641 (1985-07-01), Schriever et al.

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