4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Richard A. Nagy

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Epoxy-glass integrated circuit package having bonding pads in a

Stock material or miscellaneous articles – Structurally defined web or sheet – Including variation in thickness
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Thermoplastic plug method of fabricating an integrated circuit p

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Profile ID: LFUS-PAI-P-1457557

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