Method of patterning a thick resist layer of polymeric plastic

Details Method of patterning a thick resist layer of polymeric plastic Method of patterning a thick resist layer of polymeric plastic

1981-10-26

1982-12-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156652, 156656, 1566591, 1566611, 156668, 204192E, 427 431, 430313, 430316, 430317, 430318, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

active

043625983

ABSTRACT:
A method for producing high resolution pattern in a thick layer of polymeric plastic resist is described. The method uses a thin top layer of photo resist in which the desired pattern is formed. The pattern is transferred to a thin metallic inter-layer by wet etching the metallic layer and is subsequently transferred to the thick layer of polymeric plastic by reactive ion etching in oxygen.

REFERENCES:
patent: 3873361 (1975-03-01), Franco et al.
patent: 4092210 (1978-05-01), Hoepfner

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