Hermetically sealed package for electronic components

Details Hermetically sealed package for electronic components Hermetically sealed package for electronic components

1990-11-21

1992-04-07

Jackson, Jr., Jerome

357 72, 357 73, 357 80, H01L 2328, H01L 2329, H01L 2302, H01L 3902

Patent

active

051032910

ABSTRACT:
This package for discrete electronic components is hermetically sealed, has very low parasitic inductance and capacitance, small size, 50 ohm input and output leads, and is suitable for surface mount applications. The package has a ceramic base and lid hermetically sealed together with a solder glass seal. The ceramic base has metallized areas deposited on only the top surface to which external metal leads are brazed. The electrical contacts to the component are by way of the metallized areas, which serve double duty as mechanical attachments for the leads and electrical contacts for the component. By having the glass seal between the lid and the metallized areas, higher reliability hermetic sealing is obtained as compared with sealing to the external leads.

REFERENCES:
patent: 3736475 (1973-05-01), Berner
patent: 4722137 (1988-02-01), Ellenberger
patent: 4958216 (1990-09-01), Tanaka et al.
"Finite Element Modeling for Optimizing Hermetic Package Reliability", by John H. Lau and Lie B. Lian, The American Society of Mechanical Engineers, 88-WA/EEP-14, 9 pages, Nov. 27-Dec. 2, 1988.

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