Electronic device having a chip with an external bump terminal e

Details Electronic device having a chip with an external bump terminal e Electronic device having a chip with an external bump terminal e

1994-06-17

1995-10-24

Ledynh, Bot L.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 174260, 174264, 257778, 257780, 257787, 257791, 257690, 257788, 361760, 361736, H01L 2302, H01L 2328

Patent

active

054611970

ABSTRACT:
Since an electronic device comprises an electronic component, an external connection terminal electrically connected to the electronic component, and an envelope for sealing the electronic part and having a thickness less than about 0.5 mm, the electronic device is miniaturized even in the case where it is provided with a large number of terminals. Further, since the electronic component is sealed by the envelope, moisture, etc. is not admitted into the electronic component, resulting in high reliability. In addition, since the thickness of the envelope is thin, the external terminal can be shortened. Thus, the inductance or capacitance of this terminal can be reduced.

REFERENCES:
patent: 3512051 (1970-05-01), Noll
patent: 4641425 (1987-02-01), Dubuisson et al.
patent: 4654248 (1987-03-01), Mohammed
patent: 4772644 (1988-09-01), Itoh et al.
patent: 4825284 (1989-04-01), Soga et al.
patent: 4888450 (1989-12-01), Lando et al.
patent: 4942207 (1990-07-01), Lee et al.
patent: 4954877 (1990-09-01), Nakanishi et al.
patent: 5019673 (1991-05-01), Juskey et al.
patent: 5110664 (1992-05-01), Nakanishi et al.

Affiliated with

Also associated with

Rating

Electronic device having a chip with an external bump terminal e does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electronic device having a chip with an external bump terminal e, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electronic device having a chip with an external bump terminal e will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1888072