Semiconductor device having shallow impurity region without shor

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257382, 257408, 257410, 257900, H01L 2978, H01L 2960

Patent

active

057808961

ABSTRACT:
Elevated source and drain regions epitaxially grown on both sides of a gate structure cause a dopant impurity to form an extremely shallow p-n junctions in a semiconductor substrate so as to prevent a field effect transistor from a short channel effect, and side wall spacers include pad layers of silicon nitride and spacer layers of silicon oxide formed on the pad layers so that the elevated source and drain regions form boundaries to the pad layers without a facet and a silicon layer on the spacer layers.

REFERENCES:
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patent: 4951100 (1990-08-01), Parrillo
patent: 5182619 (1993-01-01), Pfiester
patent: 5324974 (1994-06-01), Liao
patent: 5521411 (1996-05-01), Chen et al.
patent: 5670804 (1997-09-01), Usagawa et al.
Kimura et al., "A 0.1 Micorm-gate Elevated Source and Drain MOSFET Fabricated By Phase-shifted Lithography", Technical Digest of IEDM, pp. 950-952, (1991) no month.

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