Positive type photosensitive resinous composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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430326, 522100, 522149, G03C 176

Patent

active

048699950

ABSTRACT:
A positive type photosensitive resinous composition which is specifically useful in a photoresist for printed circuit board, integrated circuit board and the like and in a lithographic plate is provided.
The resinous composition is characterized by comprising a resin having in its side chains or at the end portions of main chain at least one iminosulfonate group of the formula: ##STR1## in which R.sub.1 and R.sub.2 each is selected from hydrogen atom, an alkyl, an acyl, a phenyl, a naphthyl, an anthryl and a benzyl group, or R.sub.1 and R.sub.2 may, taken together, form an alicyclic ring, the iminosulfonate content being 1.5.times.10.sup.-4 to 2.5.times.10.sup.-3 equivalent/g and the resin being free from glycidyl group or the like which may cause polymerization in the presence of sulfonic acid.

REFERENCES:
patent: 3070443 (1962-12-01), Neugebauer et al.
patent: 4160666 (1979-07-01), McCabe et al.
patent: 4493884 (1985-01-01), Nagano et al.
patent: 4666820 (1987-05-01), Chandross et al.
patent: 4684599 (1987-08-01), Dominh et al.
patent: 4686168 (1987-08-01), Fuji et al.

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