Organic silicon compound, resist, thermal polymerization composi

Details Organic silicon compound, resist, thermal polymerization composi Organic silicon compound, resist, thermal polymerization composi

1997-02-03

1998-06-30

Chu, John S.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430170, 430192, 4302811, 4302881, 522 31, 522148, 528 40, 528 43, G03F 7004, G03F 7023, G03F 7027, G08G 7700

Patent

active

057731926

ABSTRACT:
Disclosed are an organic silicon compound having a repeating unit represented by general formula (I) shown below, a resist, a thermal polymerization composition and a photopolymerization composition containing the organic silicon compound, ##STR1## wherein R.sup.1 is a t-butyl group or a pyranyl group, R.sup.2 is an hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms, a substituted or unsubstituted aryl group having 1 to 24 carbon atoms, or a substituted or unsubstituted aralkyl having 7 to 24 carbon atoms, R.sup.3 is a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms, a substituted or unsubstituted aryl group having 6 to 24 carbon atoms, a substituted or unsubstituted aralkyl group having 7 to 24 carbon atoms or an alkoxyl group, and k represents an integer from 0 to 4.

REFERENCES:
patent: 5017453 (1991-05-01), Onishi et al.
patent: 5130392 (1992-07-01), Schwalm et al.
patent: 5350660 (1994-09-01), Urano et al.
patent: 5352564 (1994-10-01), Takeda et al.
patent: 5372908 (1994-12-01), Hayase et al.
patent: 5624788 (1997-04-01), Murai et al.
R.D. Miller, et al; Polysilanes; Photochemistry and Deep UV Lithography, 1989, vol. 29, No. 13, pp. 882-886.
Robert D. Miller, et al; Polysilane High Polymers, 1989, vol. 89, No. 6, pp. 1359-1410.

Affiliated with

Also associated with

Rating

Organic silicon compound, resist, thermal polymerization composi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Organic silicon compound, resist, thermal polymerization composi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Organic silicon compound, resist, thermal polymerization composi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1857384