Multi-layer circuit having a via matrix interlayer connection

Details Multi-layer circuit having a via matrix interlayer connection Multi-layer circuit having a via matrix interlayer connection

1996-06-14

1998-05-19

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257 70, 257758, 257693, H01L 2312, H05K 100, H05K 342

Patent

active

057539766

ABSTRACT:
An interlayer connection for electrically connecting first and second conductive elements and reducing interlayer registration requirements is disclosed. The interlayer connection includes a first layer including a first electrically conductive element, a second layer including a second electrically conductive element, and a third layer disposed between the first layer and the second layer. The third layer includes an electrically insulative portion having a matrix of immediately adjacent vias therethrough. A selected plurality of immediately adjacent vias within the matrix are disposed between the first and the second electrically conductive elements and contain electrically conductive material forming a conductive path between the first and the second electrically conductive elements.

REFERENCES:
patent: 4720915 (1988-01-01), Kennedy et al.
patent: 5184210 (1993-02-01), Westbrook
patent: 5288541 (1994-02-01), Blackwell et al.
patent: 5291092 (1994-03-01), Higgins, III
patent: 5334487 (1994-08-01), Kindl et al.
patent: 5355019 (1994-10-01), Fuchs
patent: 5381306 (1995-01-01), Schumacher et al.
patent: 5448020 (1995-09-01), Pendse
patent: 5463250 (1995-10-01), Nguyen et al.
patent: 5468681 (1995-11-01), Pasch
patent: 5487218 (1996-01-01), Bhatt et al.
patent: 5528080 (1996-06-01), Goldstein
Glenn Gengel, "Quick Turn Manufacturing of Interconnect Systems Using Predrilled and Plated Via Arrays", 14 pages.

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