Photosensitive polyamide resin composition useful for making rel

Details Photosensitive polyamide resin composition useful for making rel Photosensitive polyamide resin composition useful for making rel

1978-05-08

1980-02-12

Welsh, John D.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430306, 430906, 20415916, 20415922, G03C 168

Patent

active

041882210

ABSTRACT:
Photosensitive polyamide resin composition which can be developed with water to give a relief printing plate having an excellent moisture resistance, comprising 30 to 90% by weight of a water-soluble polyamide having ammonium type nitrogen atoms and 5 to 70% by weight of a photopolymerizable unsaturated compound prepared by reacting (meth)acrylic acid (I) and a polyglycidyl ether of an aliphatic polyvalent alcohol (II) in an equivalent ratio of 0.5.ltoreq.(I)/(II).ltoreq.2.0, and 0.01 to 10% by weight of a photopolymerization initiator.

REFERENCES:
patent: 3661576 (1972-05-01), Crary
patent: 3676145 (1962-07-01), Protzman
patent: 4043819 (1977-08-01), Baumann

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