Resist adhesion in integrated circuit processing

Details Resist adhesion in integrated circuit processing Resist adhesion in integrated circuit processing

1980-07-28

1982-06-01

Martin, Jr., Roland E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430506, 1566611, G03C 500

Patent

active

043328814

ABSTRACT:
The problem of reliably adhering resists to underlying surfaces made of, for example, phosphorus-doped silicon dioxide or silicon nitride is a particularly difficult one. In practice, the use of standard adhesion promoters such as HMDS provides only marginal relief. By baking a relatively thin layer of resist on the underlying layer, a tenacious bond between the thin layer and the underlying surface is achieved. Subsequently, a relatively thick layer of resist is applied and patterned in a standard way. An excellent bond between the thick and thin resist layers results. Subsequent processing of the patterned thick layer leaves the two noted bonded interfaces virtually intact.

REFERENCES:
patent: 3201239 (1965-08-01), Neugebauer et al.
patent: 3520683 (1970-07-01), Kerwin
patent: 3637384 (1972-01-01), Deutsch et al.
patent: 3716390 (1973-02-01), Garbarini
patent: 3737314 (1973-06-01), Ruleff et al.
patent: 3982943 (1976-09-01), Feng et al.
patent: 4130424 (1978-12-01), Feit et al.
patent: 4202914 (1980-05-01), Havas et al.
patent: 4217407 (1980-08-01), Watanabe et al.
Kaplan et al., "Two and Three Layer Photoresist Technique", IBM Tech. Discl. Bull., vol. 15, No. 7, Dec. 1972, pp. 2339-2340.
Dolgov et al., "Multilayered Thick Photoresist Mask for High Energy Ion Implants", IBM Tech. Discl. Bull., vol. 15, No. 8, Jan. 1973, p. 2570.
Chin et al., "Substrate Protective Coating", IBM Tech. Discl. Bull., vol. 19, No. 9, Feb. 1977, p. 3401.

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