Tape carrier and tape carrier device using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

Patent

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Details

257670, 257671, 257669, 257673, 257674, 257676, 438123, 438124, H01L 23495

Patent

active

060668881

ABSTRACT:
In a tape carrier, one or a plurality of overhang patterns, each being shorter than a length that reaches an edge of a semiconductor chip, is provided in an area where the pitch between adjacent inner leads is relatively large or in a corner area of the device hole where inner leads are not provided, depending upon the size of such area. An average of resin sealing ranges on the rear surface of the tapes is 0.8 mm and the diversification is 0.06 mm.

REFERENCES:
patent: 5250842 (1993-10-01), Ikeda
patent: 5825081 (1998-10-01), Hosomi et al.

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