Methods for in-situ removal of an anti-reflective coating during

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

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438952, H01L 213065

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active

06066567&

ABSTRACT:
A method is provided for removing an bottom anti-reflective coating (BARC) from a transistor gate during the etch back process associated with a resistor protect etch process. The method includes removing a silicon oxynitride BARC, in-situ, during a resistor protect etching process using a plasma formed with CF.sub.4 gas, CHF.sub.3 gas, and Argon (Ar) gas.

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