Process of producing aluminum nitride multiple-layer circuit boa

Details Process of producing aluminum nitride multiple-layer circuit boa Process of producing aluminum nitride multiple-layer circuit boa

1996-06-11

1997-11-04

Fiorilla, Christopher A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

264 61, C04B 3700

Patent

active

056835299

ABSTRACT:
A process of producing a multiple-layer circuit board of aluminum nitride, including the steps of: preparing green sheets of aluminum nitride, forming on the green sheets conductor patterns of a conductor paste containing tungsten as a main conductor component, laminating the green sheets with the conductor patterns formed thereon to form a lamination, and firing the lamination in a container made of boron nitride and in a pressurized nitrogen gas atmosphere.

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JP-A-61 84036 (Toshiba Corp.) Apr. 28, 1986 and World Patents Index Latest, Week 2386, Derwent Publications Ltd., London, GB; AN 86-148 100 & JP-A-61 84036 (Toshiba Corp.) Apr. 28, 1986.
Tsukada et al., "Metallization of an Aluminum Nitride with a Tungsten Conductor", Proceeding of the Ceramic Society of Japan (Nikon Seramikku Kyotai), Autumn 1989, pp. 82-83 (No Translation Provided).
Patent Abstracts of Japan, vol. 15, No. 151 (M-1103) Apr. 16, 1991 & JP-A-3 025288 (Toshiba Ceramics Co. Ltd.) Mar. 20, 1991.
Patent Abstracts of Japan, vol. 15, No. 221 (C-838) Jun. 6, 1991 & JP-A-3 065566 (Fujitsu Ltd.) Feb., 4, 1991.
World Patents Index Latest, Week 1492, Derwent Publications Ltd., London, GB; AN 92-109 153 & JP-A-4 050172 (Kawasaki Steel KK).

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