Method of fabricating an electronic micro-component self-sealed

Details Method of fabricating an electronic micro-component self-sealed Method of fabricating an electronic micro-component self-sealed

1989-07-07

1992-07-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156653, 156656, 156657, 1566591, 427 78, B44C 122, C23F 102, C03C 1500, C03C 2506

Patent

active

051279908

ABSTRACT:
The disclosure concerns the making of microcomponents belonging to the family of vacuum tubes of the diode, triode and electroluminescent component type. The goal thereof is notably to resolve problems of fabrication under vacuum, and of precise anode-cathode spacing. This goal is achieved by constructing a microcomponent of the stacked structure type wherein the anode is made in the form of a metallic layer for sealing the cavity under vacuum containing the microcathode, and wherein at least one solid dielectric layer provides for the spacing between the anode and the microcathode.

REFERENCES:
patent: 3921022 (1975-11-01), Levine
patent: 4163949 (1979-08-01), Shelton
patent: 4721885 (1988-01-01), Brodie

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