Method for forming encapsulated IC packages

Details Method for forming encapsulated IC packages Method for forming encapsulated IC packages

1995-04-17

1997-11-04

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29841, 26427215, 257696, 174 524, H01R 4300

Patent

active

056826737

ABSTRACT:
A mold is provided for use in encapsulating integrated circuit (IC) dies attached to die attach pads of lead frames, wherein the mold has one or more support elements in cavities of the mold for supporting the die attach pad portions of the lead frame while the mold is closed on the lead frame and encapsulation material is injected to encapsulate the IC dies and die attach pads. The support elements are, in a preferred embodiment, pins extending from the surfaces of the cavities in the mold, and the pins keep the die attach pads from moving into contact with surfaces of the cavities, so die attach pads or dies are not exposed in finished packages. In a preferred embodiment the pins each are tapered in the extended portion, so the amount of exposure of the die attach pad is absolutely minimized. In another embodiment, the support elements are retractable. In still other embodiments, support elements are beads bonded to a lead frame strip or dimples provided to a lead frame strip in the process of manufacturing the strip. Methods for practicing the invention are provided as well.

REFERENCES:
patent: 4751611 (1988-06-01), Arai et al.
patent: 4783428 (1988-11-01), Kalfus
patent: 4803030 (1989-02-01), Kobayashi
patent: 5218759 (1993-06-01), Juskey et al.
patent: 5224021 (1993-06-01), Takada et al.

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