Method of manufacturing semiconductor device and apparatus for t

Details Method of manufacturing semiconductor device and apparatus for t Method of manufacturing semiconductor device and apparatus for t

1996-05-31

1999-09-07

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438123, 2281805, H01L 2144

Patent

active

059501006

ABSTRACT:
In an apparatus for manufacturing a semiconductor device, insulator is sprayed to a bonding wire continuously fed from a capillary immediately after a first bonding to coat the bonding wire with the insulator. The spray is stopped immediately before the capillary reaches a second bonding position. Then, a second bonding is performed when the capillary reaches the second bonding position.

REFERENCES:
patent: 4678114 (1987-07-01), Egawa et al.
patent: 5045151 (1991-09-01), Edell
patent: 5396104 (1995-03-01), Kimura
patent: 5656830 (1997-08-01), Zechman

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