Method of using an anisotropically electroconductive adhesive ha

Details Method of using an anisotropically electroconductive adhesive ha Method of using an anisotropically electroconductive adhesive ha

1991-03-19

1992-06-09

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437209, 437211, H01L 21326, H01L 21479, H01L 2156, H01L 21603

Patent

active

051206650

ABSTRACT:
A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

REFERENCES:
patent: 4423435 (1983-12-01), Test, II
patent: 4654752 (1987-03-01), Kyle
patent: 4680226 (1987-07-01), Takeda
patent: 4731282 (1988-03-01), Tsukagoshi et al.
Bolger & Mooney, "Die Attach in Hi-Rel P-Dips: Polyimides or Low Chloride Epoxies?" IEEE Transactions on Components, Hybrids and Manufacturing Technology CHMT-7 (1984) Dec., No. 4, New York, USA.

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