Diffusion bonding of lead interconnections using precise laser-t

Electric heating – Metal heating – By arc

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

21912164, B23K 2600

Patent

active

059482869

ABSTRACT:
Thin film diffusion bonding of lead assemblies under severly limited spacing, thermal and pressure conditions is achieved through application of precisely controlled energy at the bond interface. The precisely controlled energy is a laser thermosonic energy pulse, delivered through a cleaved optical fiber end and closed end tip, that produces a heat increment in excess of the steady state manufacturing design temperature for the assembly and which is applied directly at the bond interface.

REFERENCES:
patent: 4278867 (1981-07-01), Tan
patent: 4330699 (1982-05-01), Farrow
patent: 4534811 (1985-08-01), Ainslie
patent: 4893742 (1990-01-01), Bullock
patent: 4894509 (1990-01-01), Chalco et al.
patent: 4970365 (1990-11-01), Chalco
patent: 5298715 (1994-03-01), Chalco et al.
patent: 5602079 (1997-02-01), Takenaka et al.
"Discrete Wire Bonding Using Laser Energy" by P. Chalco et al Semiconductor International, May 1988 pp. 130-131.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Diffusion bonding of lead interconnections using precise laser-t does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Diffusion bonding of lead interconnections using precise laser-t, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Diffusion bonding of lead interconnections using precise laser-t will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1801405

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.