Controlled in situ etch-back

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

148173, 148175, 156608, 156624, 156654, 156662, H01L 21306

Patent

active

043739890

ABSTRACT:
A controlled in situ etch-back technique is disclosed in which an etch melt 17 and a growth melt 18 are first saturated by a source-seed crystal 15 and thereafter etch-back of a substrate 14 takes place by the slightly undersaturated etch melt, followed by LPE growth of a layer by the growth melt, which is slightly supersaturated.

REFERENCES:
patent: 3692593 (1972-09-01), Hawrylo et al.
patent: 3753801 (1973-08-01), Lockwood et al.
patent: 3859178 (1975-01-01), Logan et al.
patent: 3891478 (1975-06-01), Ladany et al.
patent: 3960618 (1976-06-01), Kawamura et al.

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