Pad array semiconductor device

Details Pad array semiconductor device Pad array semiconductor device

1994-12-05

1997-01-07

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257690, 257698, 257734, H01L 2348, H01L 2304, H01L 2352

Patent

active

055920250

ABSTRACT:
Pad array carriers allow greater I/O densities over conventional leaded packages by using an array arrangement for external electrical connections. A pad array carrier (48) is manufactured using a substrate (40) having metal on only one side and unplated through-holes (44). A semiconductor die (50) is mounted on and affixed to the top surface of the substrate with an electrically insulative adhesive (51). The use of the insulative adhesive allows routing of signal traces into the die mounting region directly underneath the die. Wire bonds (52) connect the die to metal traces (46) on the substrate. A package body (54) is formed on the substrate covering the die and wire bonds (52). Solder balls (56 & 58) are directly attached to the backside of the solder pads (47) by way of the through-holes.

REFERENCES:
patent: 4691225 (1987-09-01), Murakami et al.
patent: 4700473 (1987-10-01), Freyman et al.
patent: 4807021 (1989-02-01), Okumura
patent: 5019673 (1991-05-01), Juskey et al.
patent: 5077633 (1991-12-01), Freyman et al.
patent: 5300808 (1994-04-01), Suppelsa et al.
"Pad Array Improves Density", Electronic Packaging & Production May 1992, pp. 25-26.

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