Semiconductor package having a heat slug

Details Semiconductor package having a heat slug Semiconductor package having a heat slug

1997-09-15

1999-05-18

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361690, 361715, 361718, 257676, 257697, 257773, 174 163, H05K7/20

Patent

active

059056347

ABSTRACT:
A semiconductor package uses no thermosetting adhesive for mounting a heat slug thereon, which adhesive requires a strict control during the storage and the production thereof. A semiconductor package comprises a circuit board having respective surfaces and an opening; a conductive layer formed on one of the surfaces of the circuit board so that the conductive layers are retracted from a peripheral edge of the opening by a certain distance; a heat slug attached to the one surface of the circuit board by means of solder so that the opening is closed at the one surface and opened at the other surface to form a cavity within which a semiconductor element mounting area is defined; and the heat slug is provided with a groove along a periphery of the semiconductor element mounting area and adjacent the peripheral edge of the opening.

REFERENCES:
patent: 3860949 (1975-01-01), Stoeckert et al.
patent: 5235211 (1993-08-01), Hamburgen
patent: 5478420 (1995-12-01), Gauci et al.
patent: 5481138 (1996-01-01), Economicos et al.
patent: 5622588 (1997-04-01), Weber

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