Semiconductor device and display unit using the semiconductor de

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

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Details

257666, 257676, 257673, H01L 23495, H01L 2328, H01L 2348, G09G 336

Patent

active

057675716

ABSTRACT:
To provide a semiconductor device in which a thin resin film is provided on the whole margin of the principal plane of a semiconductor chip, a lead is provided on the thin resin film, the lead is electrically connected with input and output electrode pads of the semiconductor chip, and the electrical joint is covered and sealed with a seal resin.

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patent: 5252853 (1993-10-01), Michii
patent: 5357139 (1994-10-01), Yaguchi et al.
patent: 5442231 (1995-08-01), Miyamoto et al.
patent: 5448387 (1995-09-01), Kurokawa et al.
patent: 5506444 (1996-04-01), Chikawa et al.
patent: 5585600 (1996-12-01), Froebel et al.
patent: 5585665 (1996-12-01), Anjoh et al.
patent: 5585666 (1996-12-01), Imamura

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