Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1998-09-10
2000-11-28
Nelms, David
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438453, 438547, 438598, 438618, H01L 214763
Patent
active
061535168
ABSTRACT:
A process for forming a modified polysilicon plug structure, used to connect a bit line structure, of a semiconductor memory device, to an underlying source and drain region, of a transfer gate transistor, has been developed. The process features the formation of a dual shaped opening in an insulator layer, comprised of a wide, upper opening, overlying a narrower, lower opening, which exposes the top surface of a source and drain region. Polysilicon deposition and patterning result in the formation of the modified polysilicon plug structure, comprised of a wide polysilicon trench shape, in the upper opening in the insulator layer, and an underlying, narrower polysilicon plug, in the lower opening, in the insulator layer, with the narrow polysilicon plug contacting the underlying source and drain region. An overlying bit line structure is formed, contacting the top surface of the underlying, polysilicon trench shape, exposed in a bit line via hole.
REFERENCES:
patent: 5082801 (1992-01-01), Nagata
patent: 5444020 (1995-08-01), Lee et al.
patent: 5502006 (1996-03-01), Kasagi
patent: 5529953 (1996-06-01), Shoda
patent: 5552343 (1996-09-01), Hsu
patent: 6017813 (2000-01-01), Kuo
patent: 6025227 (2000-02-01), Sung
Ackerman Stephen B.
Berry Renee R
Nelms David
Saile George O.
Vanguard International Semiconductor Corporation
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