Method of producing a thin silicon-on-insulator layer

Details Method of producing a thin silicon-on-insulator layer Method of producing a thin silicon-on-insulator layer

1992-12-10

1993-08-10

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

437 62, 437225, 437974, 148DIG12, 148DIG135, 156633, 156643, H01L 21306

Patent

active

052345351

ABSTRACT:
A method of forming a thin silicon SOI layer by wafer bonding, the thin silicon SOI layer being substantially free of defects upon which semiconductor structures can be subsequently formed, is disclosed. The method comprises the steps of:

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