Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1996-11-27
2000-03-14
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257786, 257773, 257 72, 257 59, H01L 23495, H01L 2348, H01L 2904, H01L 2352
Patent
active
060376546
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to the layout of electrodes on a semiconductor device to connect it to an external circuit, and in particular relates to a tape carrier package (TCP) which includes a semiconductor chip mounted on a tape carrier by using the tape automated bonding (TAB) technology. The present invention also relates to a display panel module which comprises a flat-type display panel, such as a liquid crystal display (LCD) or a plasma display, equipped with semiconductor chips for driving the same.
BACKGROUND ART
A tape carrier package (hereinafter referred to as TCP) made by the TAB or tape automated bonding method has been used broadly in the field of the semiconductor packaging technology, because it enables to maximize the number of pins and also to minimize the pitch of or distance between leads, so as to meet the requirements, due to the recent trend toward higher-level function and higher integration of a semiconductor chip, to increase the number of electrodes, to make the electrode pitch finer, and to make the chip size larger. In the prior art, the electrodes of a TCP have been arranged along two or all four sides on the surface of a semiconductor chip, as described in Japanese Patent Laying-open Publications Nos. 4-22146 and 5-326622. Another Japanese Patent Laying-open Publication No. 63-84039 also discloses a structure for packaging a TCP, in which bumps are formed in the central area on the surface of a semiconductor chip, so that the outer leads of a tape carrier to connect to said bumps are routed inward of the chip, and thus minimizing its mounting area and achieving higher package density. Further, the international publication No. WO91/16656 of this applicant discloses a semiconductor chip in which output electrodes are formed along a longitudinal center line of the rectangular chip.
In most liquid crystal displays, TCPs have been employed to mount driver semiconductor chips for driving a LCD, because a back-light unit can be installed to the display panel very easily and also because TCPs are suitable for automating the mounting process. Here, it is advantageous to configure the driver chips in the form of long and narrow rectangle, and to locate input and output electrodes along the opposite long sides of the rectangular chip respectively, as described in the above Japanese Publication No. 5-326622, in order to shorten the width of a TCP so that the so-called frame portion of a LCD panel is diminished.
While the longitudinal dimension or length of a TCP on which the above-mentioned long and narrow rectangular chip is mounted is generally determined by the number of electrodes and its pitch size of the chip, the lateral dimension or width of the TCP is determined mainly by 1) length of input and output outer leads, 2) length of input and output inner leads, 3) wirings routed on a tape carrier to connect the inner leads and the outer leads, and 4) length of the short side of the chip. FIGS. 10 and 11 show such a TCP as one typical example of the prior art. In the drawings, TCP 1 includes a semiconductor chip 2 as a LCD driver which is positioned in the device hole 4 formed in the center of a tape carrier 3. On the top surface of the chip 2, a number of output electrodes 5 and input electrodes 6 are arranged in one row along the opposed long sides of the chip respectively, and are bonded to inner leads 7, 8 formed to project into the device hole 4. The inner leads connect to outer leads 11, 12 by wirings 9, 10 formed on the surface of the tape carrier 3.
In this example of the prior art, the length of the outer leads 11 and 12 are determined, to some extent, by the conditions of mounting said TCP to a LCD panel and connecting it to an external input circuit, and the length of the inner leads 7 and A are determined partly by the size and pitch etc of said electrodes of the chip 2. Length of the short side of the chip 2 can be usually shortened by improving the degree of integration of the chip so that the chip size is reduced, though there is of course alway
Fenty Jesse A.
Saadat Mahshid
Seiko Epson Corporation
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