Semiconductor device and method for producing the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

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438487, H01L 2100, H01L 2120

Patent

active

059151749

ABSTRACT:
The solution (for example, a nickel acetate solution) containing a metal element such as nickel which accelerates the crystallization of silicon is applied to an amorphous silicon film by spin coating using a mask, to retain nickel in contact with the surface of the amorphous silicon film. Then, heating treatment is performed to crystallize selectively the amorphous silicon film, so that an amorphous region and a crystalline region are formed in the silicon film. In this state, the silicon film is heated to diffuse the metal element from the crystalline region to the amorphous region, thereby decreasing a concentration of the metal element in the crystalline region.

REFERENCES:
patent: Re28385 (1975-04-01), Mayer
patent: Re28386 (1975-04-01), Heiman et al.
patent: 3783049 (1974-01-01), Sandera
patent: 4007297 (1977-02-01), Robinson et al.
patent: 4231809 (1980-11-01), Schmidt
patent: 4561171 (1985-12-01), Scholosser
patent: 5010037 (1991-04-01), Lin et al.
patent: 5037774 (1991-08-01), Yamazaki et al.
patent: 5075259 (1991-12-01), Moran
patent: 5147826 (1992-09-01), Liu et al.
patent: 5225355 (1993-07-01), Sugino et al.
patent: 5244819 (1993-09-01), Yue
patent: 5264383 (1993-11-01), Young
patent: 5275851 (1994-01-01), Fonash et al.
patent: 5298075 (1994-03-01), Lagendijk et al.
patent: 5300187 (1994-04-01), Lesk et al.
patent: 5352291 (1994-10-01), Zhang et al.
patent: 5403772 (1995-04-01), Zhang et al.
patent: 5422311 (1995-06-01), Woo
patent: 5426061 (1995-06-01), Sopori
patent: 5426064 (1995-06-01), Zhang et al.
patent: 5481121 (1996-01-01), Zhang et al.
patent: 5488000 (1996-01-01), Zhang et al.
patent: 5492843 (1996-02-01), Adachi et al.
patent: 5501989 (1996-03-01), Takayama et al.
patent: 5508533 (1996-04-01), Takemura
patent: 5529937 (1996-06-01), Zhang et al.
patent: 5534716 (1996-07-01), Takemura
patent: 5543352 (1996-08-01), Ohtani et al.
patent: 5550070 (1996-08-01), Funai
patent: 5563426 (1996-10-01), Zhang et al.
patent: 5569610 (1996-10-01), Zhang et al.
patent: 5569936 (1996-10-01), Zhang et al.
patent: 5580792 (1996-12-01), Zhang et al.
patent: 5585291 (1996-12-01), Ohtani et al.
patent: 5589694 (1996-12-01), Takayama et al.
patent: 5595923 (1997-01-01), Zhang et al.
patent: 5595944 (1997-01-01), Zhang et al.
patent: 5604360 (1997-02-01), Zhang et al.
patent: 5605846 (1997-02-01), Ohtani et al.
patent: 5606179 (1997-02-01), Yamazaki et al.
patent: 5608232 (1997-03-01), Yamazaki et al.
patent: 5612250 (1997-03-01), Ohtani et al.
patent: 5614426 (1997-03-01), Funada et al.
patent: 5614733 (1997-03-01), Zhang et al.
patent: 5616506 (1997-04-01), Takemura
patent: 5620910 (1997-04-01), Teramoto
patent: 5621224 (1997-04-01), Yamazaki et al.
patent: 5624851 (1997-04-01), Takayama et al.
patent: 5637515 (1997-06-01), Takemura
patent: 5639698 (1997-06-01), Yamazaki et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5646424 (1997-07-01), Zhang et al.
patent: 5654203 (1997-08-01), Ohtani et al.
patent: 5656825 (1997-08-01), Kusumoto et al.
patent: 5663077 (1997-09-01), Adachi et al.
patent: 5677549 (1997-10-01), Takayama et al.
patent: 5696003 (1997-12-01), Makita et al.
patent: 5696386 (1997-12-01), Yamazaki
patent: 5696388 (1997-12-01), Funada et al.
patent: 5700333 (1997-12-01), Yamazaki et al.
patent: 5705829 (1998-01-01), Miyanaga et al.
patent: 5712191 (1998-01-01), Nakajima et al.
patent: 5744822 (1998-04-01), Takayama et al.
patent: 5756364 (1998-05-01), Tanaka et al.
Fan et al., "Lateralepitaxy by seeded solidification for growth of single-crystal Si films on insulators", Applied Physics Letters, vol. 38, No. 5, Mar. 1, 1981, pp. 365-367.
S. Wolf, "Silicon Processing for the VLSI ERA", vol. II, pp. 144-146, Jun. 1990 Month Unknown.
S.W. Lee et al., "Pd Induced Lateral Crystallization of a-Si . . . ", Applied Physics Letters, vol. 66, No. 13, Mar. 1995, p. 1672.
S. Caune et al., "Combined CW Laser and Furnace Annealing of a-Si . . . in Contact with Some Metals", Appl. Surf. Sci., vol. 36, 1989, p. 597 Month Unknown.
J.M. Green et al., "Method to Purify Semiconductor Wafers", IBM Tech. Discl. Bulletin, vol. 16, No. 5, Oct. 1973, p. 1612.
S.W. Lee et al., " . . . TFT . . . by Ni Induced Lateral Crystallization of a-Si . . . ", AM-LCD '95 Proceedings, Aug. 1995, p. 113.
S.F. Gong et al., " . . . Solid State Si-Metal Interactions . . . ", J. Appl. Phys., vol. 68, No. 9, Nov. 1990, p. 4542.
P.H. Robinson et al., "Use of HCl Gettering in Silicon Device Processing," J. Electrochem. Soc., vol. 118, No. 1, Jan. 1971, pp. 141-143.
Kawazu et al., "Low-Temperature Crystallization of hydrogenated Amorphous Silicon Induced by Nickel Silicide Formation", Jap. Journal of Applied Physics, vol. 29, No. 12, Dec. 1990, pp. 2698-2704.
Fortuna et al., "In Situ Study of Ion Beam Induced Si Crystallization from a Silicide Interface", Applied Surface Science 73, (1993), pp. 264-267 Month Unknown.
Carter et al., Ion Implantation of Semiconductors, John Wiley & Sons, New York, (1976), pp. 172-173 Month Unknown.
T.J. Konno, et al., "Metal contact induced crystallization of semiconductors," Mat. Sci. & Engr'g. A, vol. A179-A180 pp. 426-432, (May, 1994) (Abstract only).
C. Hayzelden et al., "In Situ Transmission Electron Microscopy Studies of Silicide-Mediated Crystallization of Amorphous Silicon" (3 pages).
A.V. Dvurechenskii et al., "Transport Phenomena in Amorphous Silicon Doped by Ion Implantation of 3d Metals", Akademikian Lavrentev Prospekt 13, 630090 Novosibirsk 90, USSR, pp. 635-640.
T. Hempel et al., "Needle-Like Crystallization of Ni Doped Amorphous Silicon Thin Films", Solid State Communications, vol. 85, No. 11, pp. 921-924, 1993.
R. Kakkad et al., "Crystallized Si films by low-temperature rapid thermal annealing of amorphous silicon," J.Appl. Phys., 65(5), Mar. 1, 1989, pp. 2069-2072.
G. Liu et al., "Polycrystalline silicon thin film transistors on Corning 7059 glass substrates using short time, low-temperature processing," Appl. Phys. Lett. 62(20), May 17, 1993, pp. 2554-2556.
G. Liu et al., "Selective area crystallization on amorphous silicon films by low-temperature rapid thermal annealing," Appl. Phys. Lett. 55(7), Aug. 14, 1989, pp. 660-662.
R. Kakkad et al., "Low Temperature Selective Crystallization of Amorphous Silicon," Journal of Non-Crystalline Solids, 115, 1989, pp. 66-68.

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