Method of forming a sealed diaphragm on a substrate

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156657, 156662, 437228, 437233, 437927, 437968, 357 26, 296211, H01L 2984

Patent

active

048490717

ABSTRACT:
The invention provides a method of forming a sealed diaphragm (3) on a substrate (1) which comprises providing on the substrate (1) a sacrificial layer (2) , providing a diaphragm layer (3) over the sacrificial layer (2), providing at least one aperture (5) in the diaphragm layer (3) which is spaced from the periphery of the diaphragm layer (3), at least partially removing the sacrificial layer (2) from between the substrate (1) and the diaphragm layer (3) by way of the at least one aperture (5) and closing the at least one aperture (5).

REFERENCES:
patent: 4262399 (1981-04-01), Cady
patent: 4581624 (1986-04-01), O'Connor
patent: 4597003 (1986-06-01), Aine et al.

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