Method for fabrication of probe card for testing of semiconducto

Details Method for fabrication of probe card for testing of semiconducto Method for fabrication of probe card for testing of semiconducto

1991-06-04

1993-07-06

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 1566591, 156902, 156668, 324158F, 324158P, 437220, 439 68, B44C 122, C23F 100

Patent

active

052250377

ABSTRACT:
A flexible polyimide film is used to support an array of precisely located contact bumps which are used to probe die on a wafer of semiconductor circuits, or an unmounted integrated circuit die, several integrated circuits, or hybrid devices. By utilizing a standard I/O contact pattern for the flexible film and fabricating the membrane assembly of interconnects on an aluminum substrate, it is possible to produce a more reliable probe card, while reducing the fabrication time and costs for the probe card. The polyimide film must be selected to have a CTE of 3 to 5, which is only about 1/5 to 1/7 as great as the CTE of the aluminum substrate on which the film is formed. This produces a critical degree of compressive stress in the polyimide film, and a resulting "bow" of the film when the central area of the aluminum is etched away.

REFERENCES:
patent: 5066357 (1991-11-01), Smyth et al.

Affiliated with

Also associated with

Rating

Method for fabrication of probe card for testing of semiconducto does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabrication of probe card for testing of semiconducto, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabrication of probe card for testing of semiconducto will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1687150