Stacked multi-chip modules and method of manufacturing

Details Stacked multi-chip modules and method of manufacturing Stacked multi-chip modules and method of manufacturing

1995-06-05

1996-02-27

Thomas, Laura

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361789, 361784, 361783, 174260, 439 69, 439 65, 439 74, 439 71, 257666, H05K 100

Patent

active

054953987

ABSTRACT:
A circuit assembly which includes a semiconductor die having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on the first surface. A first element having substantially parallel opposing first and second surfaces and at least one electrical contact mounted on one of its surfaces is mounted on and at least partially supported at its second surface by the first surface of the semiconductor die. The first element is positioned such that the semiconductor die electrical contact is exposed. A fine wire conductor having first and second ends is connected at its first end to either the semiconductor die electrical contact or the first element electrical contact. A method of manufacturing this circuit assembly is also disclosed.

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