High-operating-temperature electronic component

Details High-operating-temperature electronic component High-operating-temperature electronic component

1999-03-24

2000-11-07

Graybill, David E.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

H01K 2348, H01K 2352

Patent

active

06144104&

ABSTRACT:
A product for attaching an electronic component, such as a semiconductor die, to a substrate includes a relatively low-melting-temperature solder preform applied to the substrate; and a bead of a curable bonding material applied to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension.

REFERENCES:
patent: 4357162 (1982-11-01), Guan
patent: 4487638 (1984-12-01), Hoge
patent: 4737839 (1988-04-01), Burt
patent: 4739917 (1988-04-01), Baker
patent: 4903118 (1990-02-01), Shuhei Iwade
patent: 5504374 (1996-04-01), Oliver et al.
patent: 5612403 (1997-03-01), Nguyen et al.

Affiliated with

Also associated with

Rating

High-operating-temperature electronic component does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High-operating-temperature electronic component, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High-operating-temperature electronic component will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1644195