Process for manufacturing liquid level control structure

Details Process for manufacturing liquid level control structure Process for manufacturing liquid level control structure

1992-11-19

1994-01-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156647, 156657, 1566591, 1566611, 156662, 346140R, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

052777545

ABSTRACT:
A liquid level control structure and a method for its production. The controller is comprised of a plate having substantially flat top and bottom surfaces and an hourglass-shaped aperture containing a marking fluid. Protruding a known amount and at a known angle from opposite sides of the aperture waist are knife-edged lips that interact with the fluid's surface tension to control the location of an unbounded surface of the fluid.
The method for producing the liquid level control structure uses semiconductor fabrication techniques. The aperture is formed in a semiconductor wafer using several etching steps, some of which act along the crystalline planes of the wafer. The lips are formed from etch stop layers deposited between etching steps, while the knife-edges are formed on the ends of the lips during an etching step. Beneficially, the location of the knife-edges relative to one surface of the wafer is independent of small variations in the thickness of the water.

REFERENCES:
patent: 5204690 (1993-04-01), Lorenze et al.

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