Ultra-high density warp-resistant memory module

Details Ultra-high density warp-resistant memory module Ultra-high density warp-resistant memory module

1996-12-02

1998-10-27

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257666, 257672, 257675, 257676, 257706, 257707, 257735, 257777, B44F 122, C23F 102

Patent

active

058281258

ABSTRACT:
An ultra high-density integrated circuit module which includes a plurality of individual high-density integrated circuit packages. A plurality of the ultra high-density integrated circuit memory modules may be combined to form an ultra high-density memory bank for use in computers, or other applications requiring high-density on-board memory. The high-density integrated circuit packages which form the modules each have an internal lead frame and optional internal member which overlie an integrated circuit die. A thin, warp-resistant metal layer and an external heat conductor element are mounted to the exterior of the package. Heat is dissipated from the package while structural forces are selectively balanced.

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Information allegedly written by Emory Garth regarding "Memory Stacks," Applicants received a facsimile from Emory Garth on Jan. 26, 1993, Applicant does not know when this information was written or its validity.
Catalog of Dese-Pac Microsystems, Inc. describing two products: DPS512.times.16A3 Ceramic 512K .times.16 CMOS SRAM MODULE and DPS512.times.16AA3 High Speed Ceramic 512K.times.16 CMOS SRAM MODULE, pp. 865-870.

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