Method of fabricating capacitor structures for inclusion within

Details Method of fabricating capacitor structures for inclusion within Method of fabricating capacitor structures for inclusion within

1996-08-23

1997-12-09

Niebling, John

Fishing, trapping, and vermin destroying

437919, 437 60, H01L 2170

Patent

active

056960158

ABSTRACT:
A side-by-side capacitor structure in which the side-by-side capacitors are formed using a common dielectric layer, with a capacitor plate electrode shaped as an electrostatic shield for preventing stray capacitance between the side-by-side capacitors. More particularly, a substrate of semiconductive material has first and second contact areas on its top surface. First and second electrodes are located parallel to the top surface of the substrate of semiconductive material, but spaced therefrom by an electrically insulating layer that has first and second contact holes extending therethrough from the first and second contact areas to the first and second electrodes respectively. These contact holes are each filled with a respective conductive plug. The electrically insulating layer has a trench in its surface with first and second sides respectively aligned with an edge of the first electrode and with an edge of the second electrode. A dielectric film extends over the first electrode, the inside of the trench, and the second electrode. A third electrode extends over the dielectric film to form a first capacitor with the first electrode, the first and third electrodes providing the plates of that first capacitor, and to form a second capacitor with the second electrode, the second and third electrodes providing the plates of that second capacitor. A portion of the third electrode ex-tends into the trench as a shield against stray capacitance between the first and second electrodes.

REFERENCES:
patent: 4971924 (1990-11-01), Tigelaar et al.
patent: 5393688 (1995-02-01), Motonami et al.
patent: 5583068 (1996-12-01), Jones, Jr. et al.

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