Photosensitive resin composition containing unsaturated monomers

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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20415915, 20415916, 20415918, 20415924, 430284, 430905, 430910, 430916, 430917, 430919, 430920, 430921, 430922, G03C 168

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044381905

ABSTRACT:
A photosensitive resin composition comprising (a) at least one compound selected from the group consisting of benzotriazole, benzimidazole, benzothiazole, derivatives thereof and salts thereof, (b) a phosphate compound having photopolymeric unsaturated bonds, (c), if necessary, an organic thermoplastic polymer, (d) a photopolymerizable unsaturated compound having at least one terminal ethylene group and (e) a sensitizer and/or a sensitizer system, and a photosensitive element comprising a layer of said photosensitive resin composition and a support film therefor, are provided. The photosensitive resin composition can form a protective coating film with excellent adhesiveness to the substrate surface, and such a protective coating film or, photosensitive element obtained therefrom can be advantageously used as a resist for soldering mask, etc.

REFERENCES:
patent: 3622334 (1971-11-01), Hurley et al.
patent: 4269931 (1981-05-01), Suzuki et al.
patent: 4272607 (1981-06-01), Tsukada et al.
patent: 4289844 (1981-09-01), Specht et al.

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