Shadow clamp

Details Shadow clamp Shadow clamp

1995-03-17

1997-08-12

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

H05H 100

Patent

active

056561229

ABSTRACT:
A wafer clamping member for clamping a wafer in a plasma reaction chamber. The clamping member has a design which minimizes particle contamination of the wafer and allows more wafers to be processed before it is necessary to clean built-up deposits from the clamping member. The clamping member includes a clamping portion which clamps an outer periphery of the wafer against a bottom electrode and a shadow portion which provides a gap between an inner edge of the clamping member and the upper surface of the wafer. The gap is open to the interior of the plasma reaction chamber and preferably has a height equal to about a mean free path of a gas activated to form a plasma in the plasma reaction chamber.

REFERENCES:
patent: 4615755 (1986-10-01), Tracy et al.
patent: 4978412 (1990-12-01), Aoki et al.
patent: 5013400 (1991-05-01), Kurasaki et al.
patent: 5203981 (1993-04-01), Akazawa
patent: 5238499 (1993-08-01), van de Ven et al.
patent: 5262029 (1993-11-01), Erskine et al.
patent: 5268067 (1993-12-01), Dostalik et al.
patent: 5460703 (1995-10-01), Nulman et al.

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