Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1989-01-24
1990-09-18
Nguyen, Nam X.
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419215, 2041922, C23C 1434
Patent
active
049576046
ABSTRACT:
A thin X-ray amorphous aluminum nitride or aluminum silicon nitride film is produced on a surface by vaporization of aluminum or of aluminum and silicon by reactive sputtering or reactive magnetron sputtering under reduced pressure in a process gas atmosphere, so that a sputter gas results, and deposition of the aluminum nitride or of the aluminum silicon nitride from the sputter gas onto the said surface, resulting in the said thin X-ray amorphous aluminum nitride or aluminum silicon nitride film, by a process in which the said process gas atmosphere consists essentially of nitrogen and argon and one or more further noble gases selected from the group consisting of neon, krypton and xenon, the volume ratio of argon to the further noble gases being from 2:1 to 100:1 and the volume ratio of the further noble gases to nitrogen being from 2:1 to 10:1.
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J. M. Lagorsse & B. Serzec, "Proceedings of the Seventh National Vacuum Congress and 3rd International Conference of Solid Surfaces", Wien 1977, S. 1995-1997.
F. Takeda, T. Mori, T. Takahashi "Japanese Journal of Applied Physics", Band 20, Nr. 3, Marz 1981, S. L 164-L 172.
Li Xinjiao, Xu Zechuan, He Ziyou, Cao Huazhe, Su Wuda, Chen Zhougcai, Zhou Feng & Wang Enguang "Thin Solid Films", Band 139, 1986, S. 261-274.
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C. R. Aita, C. J. Gawlak "Journal of Vacuum Science and technology" Band A 1, Nr. 2, Apr.-Jun. 1983, S. 403-496.
BASF - Aktiengesellschaft
Nguyen Nam X.
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