Process for etching polyimide substrate in formation of unsuppor

Details Process for etching polyimide substrate in formation of unsuppor Process for etching polyimide substrate in formation of unsuppor

1989-11-29

1991-01-22

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 1566591, 156668, 156902, 252 795, B44C 122, B29C 3700, C23F 102, C03C 1500

Patent

active

049868802

ABSTRACT:
Formation of unsupported electrically conductive leads is obtained by etching of a polyimide substrate using an etching solution with a low etch ratio.

REFERENCES:
patent: 4426253 (1984-01-01), Kreuz et al.
patent: 4650545 (1987-03-01), Laakso et al.
patent: 4681654 (1987-07-01), Clementi et al.

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