Solder hierarchy for chip attachment to substrates

Details Solder hierarchy for chip attachment to substrates Solder hierarchy for chip attachment to substrates

1995-05-25

1997-08-12

Bradley, P. Austin

Metal fusion bonding

Process

Plural joints

228187, 228191, B23K 100, B23K 1018, B23K 3102

Patent

active

056557035

ABSTRACT:
The method for soldering a chip to a substrate to form a module and then soldering the module to a circuit board includes selecting a three level hierarchy of solders by the temperature required to melt. By this method, a module can be soldered to and de-soldered from a circuit board without affecting adversely the solder between the chip and the substrate. The package formed by this method is free of faults that are caused frequently during both manufacture and service.

REFERENCES:
"Reflow Solder Joint with Extended Height," IBM Tech. Discl. Bull., vol. 28, No. 7, Dec. 1985, p. 2871.
Howard H. Manko, Solders and Soldering, Second Edition, McGraw-Hill Book Company, New York, pp. 130-135 (Received Apr. 1980).

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