High current package with multi-level leads

Details High current package with multi-level leads High current package with multi-level leads

1983-09-20

1985-05-21

James, Andrew J.

357 81, 357 75, 357 68, 357 80, 357 82, H01L 2334, H01L 2312, H01L 2348, H01L 2504

Patent

active

045189820

ABSTRACT:
An improved high power semiconductor device and manufacturing method are described wherein one or more die are assembled to one electrode having a heat transfer face and additional insulated electrodes, said electrode having bent up and bent over portions forming high current terminals and control terminals such that the current terminals and control terminals lie in different planes and such that terminal spacings satisfy Underwriters Laboratory recommendations. The die and electrode assembly is partly encapsulated preferably in plastic. The current terminals are diagonally located to facilitate use of standard bus bar arrangements with different device orientations. Connection nuts are movably retained to limit transfer of tightening torque to the plastic body. Choices of materials are described.

REFERENCES:
patent: 3509434 (1970-04-01), Yanai et al.
patent: 3649803 (1972-03-01), Desmond et al.
patent: 3918084 (1975-11-01), Schierz
patent: 3946428 (1976-03-01), Anazawa et al.
patent: 4047197 (1977-09-01), Schierz
patent: 4067040 (1978-01-01), Tsuzuki et al.
patent: 4079410 (1978-03-01), Schierz
patent: 4106052 (1978-08-01), Schierz
patent: 4128802 (1978-12-01), Gansert et al.
patent: 4139859 (1979-02-01), Lewis et al.
patent: 4213141 (1980-07-01), Colussi
patent: 4242598 (1980-12-01), Johnson et al.
patent: 4322735 (1982-03-01), Sadamasa et al.
patent: 4359754 (1982-11-01), Hayakawa et al.

Affiliated with

Also associated with

Rating

High current package with multi-level leads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with High current package with multi-level leads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High current package with multi-level leads will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1541445