Hermetically sealed semiconductor ceramic package

Details Hermetically sealed semiconductor ceramic package Hermetically sealed semiconductor ceramic package

1993-07-19

1995-04-11

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257698, 257701, 257703, 257704, 257707, 257712, 257774, 361712, 361714, H01L 2302, H05K 720

Patent

active

054061202

ABSTRACT:
A ceramic hermetic package is provided having conductive material bonded into apertures in the ceramic housing that connect with a die mounted on a thin substrate through wire and pad connections. The substrate has a heat sink affixed to the bottom and electrical connections are formed on the opposite face of the package from the heat sink so that the encased semiconductor may be mounted on circuit boards in either a vertical position or in a position where the heat sink is horizontal but facing upward.

REFERENCES:
patent: 3256136 (1966-06-01), Cole et al.
patent: 3311798 (1967-03-01), Gray
patent: 3381081 (1968-04-01), Schalliol
patent: 3837000 (1974-09-01), Platzoeder et al.
patent: 3916434 (1975-10-01), Garboushian
patent: 4172261 (1979-10-01), Tsuzuki et al.
patent: 4922324 (1990-05-01), Sudo

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