Photosensitive resin composition

Details Photosensitive resin composition Photosensitive resin composition

1991-08-08

1993-04-20

Mc Camish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430906, 522135, 522142, C08F 250, G03F 7031, G03F 7035

Patent

active

052042235

ABSTRACT:
A photosensitive resin composition which is excellent in flexibility and impact resilience, which is less affected by humidity is provided. This composition comprises a soluble synthetic polymer, a photo-polymerizable unsaturated compound, and a photo-polymerization initiator, wherein the soluble synthetic polymer comprises an addition polymer obtained by the reaction between a diamine compound having amino groups selected from primary and secondary amino groups and having no amide bonds in its molecule and a diisocyanate compound; and the addition polymer contains a polyoxyalkylene glycol component in an amount of 20 to 80% by weight.

REFERENCES:
patent: 2948611 (1960-08-01), Barney
patent: 4145222 (1979-03-01), Etoh et al.
patent: 4337307 (1982-06-01), Neubauer
patent: 4544624 (1985-10-01), Nanpei et al.
patent: 4999279 (1991-03-01), Takenaka

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