Transducer having a resonating silicon beam and method for formi

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438 53, 438409, 438411, H01L 2100, H01L 2176

Patent

active

058343334

ABSTRACT:
A method of forming apparatus including a force transducer on a silicon substrate having an upper surface, the silicon substrate including a dopant of one of the n-type or the p-type, the force transducer including a cavity having spaced end walls and a beam supported in the cavity, the beam extending between the end walls of the cavity, the method including the steps of: (a) implanting in the substrate a layer of a dopant of said one of the n-type or the p-type; (b) depositing an epitaxial layer on the upper surface of the substrate, the epitaxial layer including a dopant of the other of the n-type or the p-type; (c) implanting a pair of spaced sinkers through the epitaxial layer and into electrical connection with said layer, each of the sinkers including a dopant of the one of the n-type or the p-type; (d) anodizing the substrate to form porous silicon of the sinkers and the layer; (e) oxidizing the porous silicon to form silicon dioxide; and (f) etching the silicon dioxide to form the cavity and beam.

REFERENCES:
patent: 3909924 (1975-10-01), Vindasius et al.
patent: 4258565 (1981-03-01), Sawayama et al.
patent: 4532700 (1985-08-01), Kinney et al.
patent: 4567451 (1986-01-01), Greenwood
patent: 4628591 (1986-12-01), Zorinsky et al.
patent: 4628740 (1986-12-01), Ueda et al.
patent: 4665610 (1987-05-01), Barth
patent: 4744863 (1988-05-01), Guckel et al.
patent: 4766666 (1988-08-01), Sugiyama et al.
patent: 4771638 (1988-09-01), Sugiyama et al.
patent: 4771639 (1988-09-01), Saigusa et al.
patent: 4772786 (1988-09-01), Langdon
patent: 4784721 (1988-11-01), Holmen et al.
patent: 4800759 (1989-01-01), Hirata et al.
patent: 4805456 (1989-02-01), Howe et al.
patent: 4841272 (1989-06-01), Yamagishi et al.
patent: 4841775 (1989-06-01), Ikeda et al.
patent: 4853669 (1989-08-01), Guckel et al.
patent: 4889590 (1989-12-01), Tucker et al.
patent: 4893509 (1990-01-01), MacIver et al.
patent: 4897360 (1990-01-01), Guckel et al.
patent: 4901570 (1990-02-01), Chang et al.
patent: 4926143 (1990-05-01), Harada et al.
patent: 4945769 (1990-08-01), Sidner et al.
patent: 4956795 (1990-09-01), Yamaguchi et al.
patent: 4966649 (1990-10-01), Harada et al.
patent: 4975390 (1990-12-01), Fujii et al.
patent: 4993143 (1991-02-01), Sidner et al.
patent: 5009108 (1991-04-01), Harada et al.
patent: 5090254 (1992-02-01), Guckel et al.
patent: 5095401 (1992-03-01), Zavracky et al.
patent: 5110373 (1992-05-01), Mauger
patent: 5242863 (1993-09-01), Xiang-Zheng et al.
patent: 5313836 (1994-05-01), Fujii et al.
patent: 5332469 (1994-07-01), Mastrangelo
patent: 5352635 (1994-10-01), Tu et al.
patent: 5427975 (1995-06-01), Sparks et al.
H. Guckel et al., "Planar Processed, Integrated Displacement Sensors", Micromachining and Micropackaging of Transducers, Elsevier Science Publishers B.V., Amsterdam, 1985, pp. 199-203.
H. Guckel et al., "A Technology for Integrated Transducers", Wisconsin Center for Applied Microelectronics, 1985, pp. 90-92.
Ikeda et al., "Silicon Pressure Sensor with Resonant Strain Gages Built into Diaphragm", Technical Digest of the 7th Sensor Symposium, 1988, pp. 55-58.
Ikeda et al., "Three Dimesional Micromachining of Silicon Resonant Strain Gage", Technical Digest of the 7th Sensor Symposium, 1988, pp. 193-196.
Lee, "The Fabrication of Thin, Freestanding, Single-Crystal, Semiconductor Membranes", J. Electrochem. Soc., vol. 137, No. 8, 1990, pp. 2556-2574.
H. Guckel, "Surface micromachined pressure transducers", Sensors and Actuators A, 28, 1991, pp. 133-146.
Yoshida et al., "Photo-Induced Preferential Anodization for Fabrication of Monocrystalline Micromechanical Structures", Micro Electro Mechanical Systems, pp. 56-61, Feb. 4-7, 1992.
Anderson et al., "Porous Polycrystalline Silicon: A New Material for MEMS", Journal of Microeletromechanical Systems, vol. 3, No. 1, Mar. 1994, pp. 10-18.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Transducer having a resonating silicon beam and method for formi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Transducer having a resonating silicon beam and method for formi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Transducer having a resonating silicon beam and method for formi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1516089

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.