Physical vapor deposition of titanium nitride on a nonconductive

Details Physical vapor deposition of titanium nitride on a nonconductive Physical vapor deposition of titanium nitride on a nonconductive

1993-08-25

1999-01-12

Nguyen, Nam

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

427523, 427530, C23C 1434

Patent

active

058581812

ABSTRACT:
A process for physical vapor deposition of a refractory coating such as titanium nitride on a nonconductive substrate such as a ceramic substrate and the coated substrate produced thereby. The nonconductive substrate is coated by cleaning the nonconductive substrate surfaces and then depositing a first layer of a refractory metal such as titanium metal on the nonconductive substrate by physical vapor deposition. A second layer of a refractory compound such as titanium nitride is then deposited on the first layer by physical vapor deposition to produce a coated nonconductive substrate having enhanced coating adhesion.

REFERENCES:
patent: 3329601 (1967-07-01), Mattox
patent: 3900592 (1975-08-01), Kennedy et al.
patent: 3988955 (1976-11-01), Engel et al.
patent: 4127416 (1978-11-01), Lumby et al.
patent: 4169913 (1979-10-01), Kobayashi et al.
patent: 4226082 (1980-10-01), Nishida
patent: 4252862 (1981-02-01), Nishida
patent: 4337300 (1982-06-01), Itaba et al.
patent: 4399168 (1983-08-01), Kallander et al.
patent: 4401719 (1983-08-01), Kobayashi
patent: 4402994 (1983-09-01), Kobayashi et al.
patent: 4406669 (1983-09-01), Sarin et al.
patent: 4411960 (1983-10-01), Mizuhara
patent: 4461799 (1984-07-01), Gavrilov et al.
patent: 4469489 (1984-09-01), Sarin et al.
patent: 4507189 (1985-03-01), Doi et al.
patent: 4532149 (1985-07-01), McHargue
patent: 4539251 (1985-09-01), Sugisawa et al.
patent: 4547470 (1985-10-01), Tanase et al.
patent: 4563433 (1986-01-01), Yeckley et al.
patent: 4578087 (1986-03-01), Tanaka et al.
patent: 4619748 (1986-10-01), Moll et al.
patent: 4634600 (1987-01-01), Shimizu et al.
patent: 4693944 (1987-09-01), Sugisawa et al.
patent: 4801510 (1989-01-01), Mehrotra et al.
patent: 4810530 (1989-03-01), D'Angelo et al.
patent: 4818635 (1989-04-01), Ekstrom et al.
patent: 4852999 (1989-08-01), Mehrotra et al.
patent: 4902395 (1990-02-01), Yoshimura
patent: 4959331 (1990-09-01), Mehrotra et al.
patent: 4959332 (1990-09-01), Mehrotra et al.
patent: 4960735 (1990-10-01), Mehrotra et al.
patent: 4965231 (1990-10-01), Mehrotra et al.
patent: 4973388 (1990-11-01), Francois et al.
B. North, "Ceramic Cutting Tools--A Review," Int. J. High Technology Ceramics (1987) pp. 113-127.
Metals Handbook Ninth Ed., American Society for Metals (1980) pp. 448 to 465, 372-379, 858.
"Designing with Kennametal," Kennametal Inc. (1967), inside front cover: pp. 1-3).
"Properties and Proven Uses of Kennametal Hard Carbide Alloys," (1977) pp. 14 and 15.
Guy, "Elements of Physical Metallurgy," Addison-Wesley Pub. Co. (1959), p. 256.
Rao et al., "Electrical and Thermal Conductivity of Sialon Ceramics," Ceramic Bulletin, vol. 57, No. 6 (1978) pp. 591-595.
Jindal et al., "Adhesion Measurements of Chemically Vapor Deposited and Physically Vapor Deposited Hard Coatings on WC-Co Substrates," Thin Solid Films, 154 (1987) pp. 361-375.
Thorp et al., "Electrical Conductivity in Hot-Pressed Nitrogen Ceramics," Journal of Materials Science 11 (1976) pp. 1494-1500.
"Mechanical and Electrical Properties of AlSiMag Ceramics," Chart No. 691, American Lava Corporation.
Coad, J. P., Warrington, P., Newberry, R. B. & Jacobs, M. H., "Titanium Nitride Coatings by Sputter Ion Plating," Materials and Design, vol. VI,No. 4, pp. 190-195.
Encyclopedia of Chemical Technology, vol. 20, p. 42 (3rd Edition).
McGraw-Hill, Dictionary of Scientific and Technical Terms, Fourth Edition, p. 322 (1989).

Affiliated with

Also associated with

Rating

Physical vapor deposition of titanium nitride on a nonconductive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Physical vapor deposition of titanium nitride on a nonconductive, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Physical vapor deposition of titanium nitride on a nonconductive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1510715