Method for simultaneously manufacturing chip-scale package using

Details Method for simultaneously manufacturing chip-scale package using Method for simultaneously manufacturing chip-scale package using

1997-06-30

1999-09-14

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156300, 29856, 29881, 26427217, H05K 330

Patent

active

059518049

ABSTRACT:
A method for simultaneously manufacturing chip-scale packages employing a lead frame strip having a plurality of lead frames. The method includes the steps of forming the lead frame strip and the plurality of TAB tapes, and then simultaneously bonding bottom surfaces of parallel leads and tie bars of each of the respective lead frames to a top surface of the TAB tape. A plurality of chips are attached to the top surface of the TAB tape and the chips are electrically connected to contact leads formed on the TAB tape. The chips and electrical connections are then encapsulated with a molding resin to form individual packages. The individual packages are then separated from the lead frame strip.

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patent: 5357400 (1994-10-01), Takekawa
patent: 5440452 (1995-08-01), Kitahara

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