Universal alignment marks for semiconductor defect capture and a

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

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356399, G01B 1100

Patent

active

060846798

ABSTRACT:
A method of using universal alignment marks on a semiconductor wafer that allows the accurate alignment of scanning and analysis tools in relation to the semiconductor wafer. The information in the universal alignment marks are utilized by a vendor generated algorithm incorporated into the respective scanning or analysis tools to accurately position the tool in relation to the semiconductor wafer.

REFERENCES:
patent: 5910847 (1999-06-01), Van der Werf et al.

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