Semiconductor device having a catalyst enhanced crystallized lay

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

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060842474

ABSTRACT:
Semiconductor devices such as thin-film transistors formed by annealing a substantially amorphous silicon film at a temperature either lower than normal crystallization temperature of amorphous silicon or lower than the glass transition point of the substrate so as to crystallize the silicon film. Islands, stripes, lines, or dots of nickel, iron, cobalt, or platinum, silicide, acetate, or nitrate of nickel, iron, cobalt, or platinum, film containing various salts, particles, or clusters containing at least one of nickel, iron, cobalt, and platinum are used as starting materials for crystallization. These materials are formed on or under the amorphous silicon film.

REFERENCES:
patent: Re28385 (1975-04-01), Mayer
patent: Re28386 (1975-04-01), Heiman et al.
patent: 3783049 (1974-01-01), Sandera
patent: 4231809 (1980-11-01), Schmidt
patent: 4727044 (1988-02-01), Yamazaki
patent: 4783379 (1988-11-01), Wickersham et al.
patent: 4810673 (1989-03-01), Freeman
patent: 5010037 (1991-04-01), Lin et al.
patent: 5075259 (1991-12-01), Moran
patent: 5147826 (1992-09-01), Liu et al.
patent: 5225355 (1993-07-01), Sugino et al.
patent: 5244819 (1993-09-01), Yue
patent: 5264383 (1993-11-01), Young
patent: 5275851 (1994-01-01), Fonash et al.
patent: 5298075 (1994-03-01), Lagendijk et al.
patent: 5300187 (1994-04-01), Lesk et al.
patent: 5313076 (1994-05-01), Yamazaki
patent: 5403772 (1995-04-01), Zhang et al.
patent: 5422311 (1995-06-01), Woo
patent: 5426064 (1995-06-01), Zhang et al.
patent: 5481121 (1996-01-01), Zhang et al.
patent: 5488000 (1996-01-01), Zhang et al.
patent: 5492843 (1996-02-01), Adachi et al.
patent: 5501989 (1996-03-01), Takayama et al.
patent: 5508533 (1996-04-01), Takemura
patent: 5529937 (1996-06-01), Zhang et al.
patent: 5534716 (1996-07-01), Takemura
patent: 5543352 (1996-08-01), Ohtani et al.
patent: 5563426 (1996-10-01), Zhang et al.
patent: 5569610 (1996-10-01), Zhang et al.
patent: 5569936 (1996-10-01), Zhang et al.
patent: 5580792 (1996-12-01), Zhang et al.
patent: 5585291 (1996-12-01), Ohtani et al.
patent: 5589694 (1996-12-01), Takayama et al.
patent: 5595923 (1997-01-01), Zhang et al.
patent: 5595944 (1997-01-01), Zhang et al.
patent: 5604360 (1997-02-01), Zhang et al.
patent: 5605846 (1997-02-01), Ohtani et al.
patent: 5606179 (1997-02-01), Yamazaki et al.
patent: 5608232 (1997-03-01), Yamazaki et al.
patent: 5612250 (1997-03-01), Ohtani et al.
patent: 5614426 (1997-03-01), Funada et al.
patent: 5614733 (1997-03-01), Zhang et al.
patent: 5616506 (1997-04-01), Takemura
patent: 5620910 (1997-04-01), Teramoto
patent: 5621224 (1997-04-01), Yamazaki et al.
patent: 5624851 (1997-04-01), Takayama et al.
patent: 5637515 (1997-06-01), Takemura
patent: 5639698 (1997-06-01), Yamazaki et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5646424 (1997-07-01), Zhang et al.
patent: 5654203 (1997-08-01), Ohtani et al.
patent: 5656825 (1997-08-01), Kusumoto et al.
patent: 5663077 (1997-09-01), Adachi et al.
patent: 5677549 (1997-10-01), Takayama et al.
patent: 5696386 (1997-12-01), Yamazaki
patent: 5696388 (1997-12-01), Funada et al.
patent: 5700333 (1997-12-01), Yamazaki et al.
patent: 5705829 (1998-01-01), Miyanaga et al.
patent: 5712191 (1998-01-01), Nakajima et al.
patent: 5756364 (1998-05-01), Tanaka et al.
Canali et al., "Solid-Phase Epitaxial Growth of Si Through Palladium Silicide Layers", Journal of Applied Physics, ol. 46, No. 7, Jul. 1975, pp. 2831-2836.
Thompson et al., "Schottky Barrier Amorphous-Crystalline Interface Formation", Surface Science, vol. 132, (1983), pp. 250-263.
C. Hayzelden et al., "In Situ Transmission Electron Microscopy Studies of Silicide-Mediated Crystallization of Amorphous Silicon" (3 pages).
A.V. Dvurechenskii et al., "Transport Phenomena in Amorphous Silicon Doped by Ion Implantation of 3d Metals", Akademikian Lavrentev Prospekt 13, 630090 Novosibirsk 90, USSR, pp. 635-640.
T. Hempel et al., "Needle-Like Crystallizationf Ni Doped Amorphous Silicon Thin Films", Solid State Communications, vol. 85, No. 11, pp. 921-924, 1993.
Kawazu et al., "Low-Temperature Crystallization of Hydrogenated Amorphous Silicon Induced by Nickel Silicide Formation", Japanese Journal of Applied Physics, vol. 19, No. 12, Dec. 1990, pp. 2698-2704.
Fortuna et al., In Situ Study of Ion Beam Induced Si Crystallization From a Silicide Interface, Applied Surface Science 73(1993) pp. 264-267.
"Crystallied Si Films By Low-Temperature Rapid Thermal Annealing of Amorphous Silicon", R. Kakkad, J. Smith, W.S. Lau, S.J. Fonash, J. Appl. Phys. 65 (5), Mar. 1, 1989, 1989 American Institute of Physics, p. 2069-2072.
"Polycrystalline Silicone Thin Film Transistors on Corning 7059 Glass Substrates Using Short Time, Low Temperature Processing", G. Liu, S.J. Fonash, Appl. Phys. Lett. 62(20), May 17, 1993, 1993 American Institute of Physics, p. 2554-2556.
"Selective Area Crystallization of Amorphous Silicon Films by Low-Temperature Rapid Thermal Annealing", Gang Liu and S.J. Fonash, Appl. Phys. Lett 55(7), Aug. 14, 1989, 1989 American Institute of Physics, p. 660-662.
"Low Temperature Selective Crystallization of Amorphous Silicon", R. Kakkad, G. Liu, S.J. Fonash, Journal of Non-Crystalline Solids, vol. 115, (1989), p. 66-68.
Nemanich et al., "Structure and Growth of the Interface of Pd on .alpha.-Si:H", The American Physical Society--Physical Review B, vol. 22, No. 12, pp. 6828-6832, Jun. 15, 1981.
Thompson et al., "Silicide Formation in Pd-.alpha.-Si:H Schottky Barriers", Appl. Phys. Lett., vol. 39, No. 9, pp. 274-278, Aug. 1, 1981.
Nemanich et al.,"Initial Phase Formation at the Interface of Ni, Pd, or Pt and Si", Mat, Res, Soc. Symp. Proc., 6 pages, 1984.
S. Wolf, "Silicon Processing for the VLSI ERA" vol. II, pp. 144-46, Jun., 1990.
S.-W. Lee, et al. Appl. Phys. Lett., 66(13)(1995) 1672, "Pd Induced Lateral Crystallization of a-Si..", Mar., 1995.
S. Caune et al., Appl. Surf. Sci., 36(1989) 597 "Combined CW laser and furnace annealing of a-Si . . . in contact with some metals". 1989.
J.M.Green et al., IBM Tech. Discl. Bulletin, 16(5) (1973) 1612, "Method to purify semiconductor wafers", Oct., 1973.
S.-W. Lee, et al., AM-LCD '95 Proceedings, p. 113, " . . . TFT . . . by Ni Induced Lateral Crystallization of a-Si . . . ", Aug., 1995.
S.F. Gong, et al., J.Appl. Phys., 68(9)(1990)(4542), " . . . Solid State Si-Metal Interactions . . . ", Nov., 1990.
P.H. Robinson et al., "Use of HCI Gettering in Silicon Device Processing," J. Electrochem. Soc., V.118, No. 1, pp. 141-3, Jan. 1971.

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