Mask repattern process

Details Mask repattern process Mask repattern process

1998-10-27

2000-07-04

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438640, H01L 2144

Patent

active

060838205

ABSTRACT:
The present invention relates to an improve method for forming a UBM pad and solder bump connection for a flip chip which eliminates at least two mask steps required in standard UBM pad forming processes when repatterning the bond pad locations.

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